Name:

Description:

The solder.balance data frame has 900 rows and 7 columns, representing a balanced subset of a designed experiment varying 5 factors on the soldering of components on printed-circuit boards.

The solder data frame is the full version of the data with 900 rows. It is located in both the rpart and the survival packages.

Variables:

This data frame contains the following columns:

Opening

a factor with levels L, M and S indicating the amount of clearance around the mounting pad.

Solder

a factor with levels Thick and Thin giving the thickness of the solder used.

Mask

a factor with levels A1.5, A3, B3 and B6 indicating the type and thickness of mask used.

PadType

a factor with levels D4, D6, D7, L4, L6, L7, L8, L9, W4 and W9 giving the size and geometry of the mounting pad.

Panel

1:3 indicating the panel on a board being tested.

skips

a numeric vector giving the number of visible solder skips.

Link To Google Sheets:

Rows:

Columns:

Files:

License Type:

References/Notes/Attributions:

Source

John M. Chambers and Trevor J. Hastie eds. (1992) Statistical Models in S, Wadsworth and Brooks/Cole, Pacific Grove, CA.

R Dataset Upload:

Use the following R code to directly access this dataset in R.

R Coding Interface: