Name:

Description:

In 1988 an experiment was designed and implemented at one of AT&T's factories to investigate alternatives in the "wave soldering" procedure for mounting electronic componentes to printed circuit boards. The experiment varied a number of factors relevant to the process. The response, measured by eye, is the number of visible solder skips.

Variables:

A data frame with 900 observations on the following 7 variables.

Opening

the amount of clearance around the mounting pad (3 levels)

Solder

the amount of solder (Thick or Thin)

Mask

type and thickness of the material used for the solder mask (A1.5, A3, A6, B3, B6)

PadType

the geometry and size of the mounting pad (10 levels)

Panel

each board was divided into 3 panels

skips

the number of skips

Link To Google Sheets:

Rows:

Columns:

Files:

License Type:

References/Notes/Attributions:

References

J Chambers and T Hastie, Statistical models in S. Chapman and Hall, 1993.

R Dataset Upload:

Use the following R code to directly access this dataset in R.

R Coding Interface: